Portable electronic apparatus

ABSTRACT

A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.

BACKGROUND

The invention relates to a portable electronic apparatus, and moreparticularly to a portable electronic apparatus with a heat-dissipationfunction.

When a portable electronic apparatus (for example, a personal digitalassistant or a cell phone) performs wireless network communication orother high energy-consumptive operations, heat produced by chips movesto light-emitting elements, batteries or other electronic elementsthereof via a circuit board, and raising the temperature thereof. Thisdamages electronic elements and shortens lifespan. Additionally, batterycharging chips produce high temperatures during the battery charging andsuch high temperatures may explode batteries (particularly lithiumbattery).

SUMMARY

An embodiment of a portable electronic apparatus comprises a housing, acircuit board, a heat-conduction structure and a heat-dissipationstructure. The circuit board is disposed in the housing and comprises asubstrate and a first electronic device, wherein the first electronicdevice is disposed on the substrate. The heat-conduction structure isdisposed on the circuit board, and dissipates heat from the firstelectronic device. The heat-dissipation structure is disposed on thehousing and connected to the heat-conduction structure, wherein the heatpasses the heat-conduction structure and the heat-dissipation structure,and is dissipated out of the housing.

The invention reduces inner temperature of the portable electronicapparatus, increases the lifespan of chips and light-emitting elementsthereof, and prevents the battery from exploding.

DESCRIPTION OF THE DRAWINGS

The invention will be more fully understood from the following detaileddescription and the accompanying drawings, given by the way ofillustration only and thus not intended to limit the invention.

FIG. 1 a is an exploded view of a portable electronic apparatus of afirst embodiment;

FIG. 1 b shows the partially assembled portable electronic apparatus;

FIG. 1 c shows the completely assembled portable electronic apparatus;

FIG. 2 a is a bottom view of a heat-conduction structure of the firstembodiment;

FIG. 2 b is a sectional view of a circuit board and the heat-conductionstructure of the first embodiment;

FIG. 2 c shows heat dissipated out of the portable electronic apparatusof the first embodiment;

FIG. 3 a shows a portable electronic apparatus of a second embodiment;

FIG. 3 b is a sectional view of a circuit board and a heat-conductionstructure of the second embodiment;

FIG. 3 c shows heat dissipated out of the portable electronic apparatusof the second embodiment.

DETAILED DESCRIPTION First Embodiment

FIG. 1 a is an exploded view of a portable electronic apparatus 100 ofthe invention, which comprises a housing 10, a circuit board 20, aheat-conduction structure 30, a heat-dissipation structure 40 and acontrol interface 50. The housing 10 comprises a first housing portion11 and a second housing portion 12. The control interface 50 is disposedon the first housing portion 11. The circuit board 20 and theheat-conduction structure 30 are disposed in the housing 10. The circuitboard 20 comprises a first electronic device 21, second electronicdevices 22 and a substrate 23. The first electronic device 21 and thesecond electronic devices 22 are disposed on the substrate 23. Theheat-conduction structure 30 is disposed on the circuit board 20 andcomprises a mounting hole 31. The heat-dissipation structure 40 is acell phone cover made of metal, particularly copper, and comprises pivotportions 41. The heat-conduction structure 30 and the heat-dissipationstructure 40 compose a heat-dissipation module. With reference to FIG. 1b, when the portable electronic apparatus 100 is assembled, theheat-conduction structure 30 is fixed on the circuit board 20. Bolts 42pass the pivot portions 41 and the housing 10, and are enter mountingholes 31 of the heat-conduction structure 30. The heat-dissipationstructure 40 thus pivots on the heat-conduction structure 30. Then, asshown in FIG. 1 c, the first housing portion 11 and the second housingportion 12 are assembled.

In the disclosure, electronic devices (for example, chips, resistors,and print circuits) are represented by the first electronic device 21and the second electronic devices 22 to simplify description.

FIG. 2 a is a bottom view of the heat-conduction structure 30, which isan isolation cover comprising metal, such as copper. The heat-conductionstructure 30 comprises spacers 32 disposed on a surface thereof defininga plurality of isolation regions 33. With reference to FIG. 2 b, whenthe heat-conduction structure 30 is disposed on the circuit board 20,the first electronic device 21 and the second electronic devices 22 aredisposed in different isolation regions 33 by the spacer 32. The firstelectronic device 21 and the second electronic devices 22 keep a gap dfrom the heat-conduction structure 30. The gap d is between 0.1-0.05 mm.Noise between the first electronic device 21 and the second electronicdevices 22 is reduced by disposing the first electronic device 21 andthe second electronic devices 22 in different isolation regions 33. Theheat produced by the first electronic device 21 and the secondelectronic devices 22 is transmitted to the heat-conduction structure 30via radiation and conduction (for example, via the air in the isolationregions 33 or via the substrate 23). As shown in FIG. 2 c, theheat-dissipation structure 40 pivots on the heat-conduction structure 30by metal bolts 42. The heat thus passes the heat-conduction structure 30to the heat-dissipation structure 40 to be dissipated out of the housing10.

In this embodiment of the invention, the heat-dissipation structure 40is a cell phone cover, but is not limited thereof. The heat-dissipationstructure 40 can be a metal sheet disposed on a surface of the housing10 or other structure.

The invention reduces inner temperature of the portable electronicapparatus, increases the lifespan of chips and light-emitting elementsthereof, and prevents the battery from exploding.

Second Embodiment

FIG. 3 a shows a portable electronic apparatus 200 of a secondembodiment of the invention, which is a slide phone comprising a housing10′, a circuit board 20, a heat-conduction structure 30′, aheat-dissipation structure 40′ and a control interface 50′. The controlinterface 50′ is disposed on the housing 10′. The housing 10′ comprisesa sliding cover 11′ and a body 12′. The body 12′ comprises grooves 122allowing the sliding cover 11′ to slide thereon. The circuit board 20and the heat-conduction structure 30′ are disposed in the body 12′. Theheat-dissipation structure 40′ is a metal sheet disposed on a surface ofthe sliding cover 11′.

As shown in FIG. 3 b, in the second embodiment, the top of theheat-conduction structure 30′ is exposed on a first surface 121 of thebody 12′. The heat-dissipation structure 40′ is disposed on a secondsurface 111 of the sliding cover 11′. The top of the heat-conductionstructure 30′ directly contacts the heat-dissipation structure 40′. Asshown in FIG. 3 c, the heat inside the portable electronic apparatus 200thus passes the heat-conduction structure 30′ to the heat-dissipationstructure 40′ to be dissipated out of the housing 10.

In this embodiment of the invention, the portable electronic apparatus200 is a slide phone, but is not limited thereto. The portableelectronic apparatus 200 can also be a rotating phone. Theheat-dissipation structure 40′ is not limited disposition on the cover,and can be disposed on other locations on the portable electronicapparatus 200.

While the invention has been described by way of example and in terms ofpreferred embodiment, it is to be understood that the invention is notlimited thereto. To the contrary, it is intended to cover variousmodifications and similar arrangements (as would be apparent to thoseskilled in the art). Therefore, the scope of the appended claims shouldbe accorded the broadest interpretation to encompass all suchmodifications and similar arrangements.

1. A portable electronic apparatus, comprising: a housing; a circuitboard, disposed in the housing and comprising a substrate and a firstelectronic device, wherein the first electronic device is disposed onthe substrate; a heat-conduction structure, disposed on the circuitboard for dissipating a heat from the first electronic device; and aheat-dissipation structure disposed on the housing and connected to theheat-conduction structure for dissipating the heat out of the housingfrom the heat-conduction structure.
 2. The portable electronic apparatusas claimed in claim 1, wherein the heat-conduction structure comprisesan isolation cover.
 3. The portable electronic apparatus as claimed inclaim 2, wherein the heat-conduction structure contacts the substrate,and keeps a first gap from the first electronic device.
 4. The portableelectronic apparatus as claimed in claim 3, wherein the heat istransmitted from the first electronic device to the heat-conductionstructure via radiation and/or conduction.
 5. The portable electronicapparatus as claimed in claim 2, wherein the circuit board furthercomprises a second electronic device disposed thereon, and the isolationcover isolates the first electronic device from the second electronicdevice.
 6. The portable electronic apparatus as claimed in claim 5,wherein the isolation cover comprises a spacer disposed between thefirst electronic device and the second electronic device, isolating thefirst electronic device from the second electronic device.
 7. Theportable electronic apparatus as claimed in claim 1, wherein a materialof the heat-conduction structure comprises metal.
 8. The portableelectronic apparatus as claimed in claim 1, wherein the heat-dissipationstructure is a cell phone cover pivoting on the heat-conductionstructure.
 9. The portable electronic apparatus as claimed in claim 8,wherein a material of the cell phone cover comprises metal.
 10. Theportable electronic apparatus as claimed in claim 9, wherein a materialof the cell phone cover comprises copper.
 11. A heat-dissipation modulefor dissipating a heat from a circuit board, the circuit boardcomprising a substrate and a first electronic device, the firstelectronic device disposed on the substrate, the heat-dissipation modulecomprising: a heat-conduction structure, disposed on the circuit boardfor dissipating the heat from the first electronic device; and aheat-dissipation structure connected to the heat-conduction structurefor dissipating the heat from the heat-conduction structure.
 12. Theheat-dissipation module as claimed in claim 11, wherein theheat-conduction structure comprises an isolation cover.
 13. Theheat-dissipation module as claimed in claim 11, wherein theheat-conduction structure contacts the substrate, and keeps a first gapfrom the first electronic device.
 14. The heat-dissipation module asclaimed in claim 13, wherein the heat is transmitted from the firstelectronic device to the heat-conduction structure via radiation and/orconduction.
 15. The heat-dissipation module as claimed in claim 12,wherein the circuit board further comprises a second electronic devicedisposed thereon, and the isolation cover isolates the first electronicdevice from the second electronic device.
 16. The heat-dissipationmodule as claimed in claim 15, wherein the isolation cover comprises aspacer disposed therein, between the first electronic device and thesecond electronic device and isolating the first electronic device fromthe second electronic device.
 17. The heat-dissipation module as claimedin claim 11, wherein a material of the heat-conduction structurecomprises metal.
 18. The heat-dissipation module as claimed in claim 11,wherein a material of the heat-conduction structure comprises copper.